DS96F172MJ/883 vs DS90LV032ATMTC feature comparison

DS96F172MJ/883 National Semiconductor Corporation

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DS90LV032ATMTC National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description CERAMIC, DIP-16 0.100 INCH, PLASTIC, TSSOP-16
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES
Driver Number of Bits 4
High Level Input Current-Max 0.00002 A
Input Characteristics STANDARD DIFFERENTIAL
Interface IC Type LINE DRIVER LINE RECEIVER
Interface Standard EIA-422; EIA-485 EIA-644; TIA-644
JESD-30 Code R-GDIP-T16 R-PDSO-G16
JESD-609 Code e0 e0
Length 19.43 mm 5 mm
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Out Swing-Min 1.5 V
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP16,.3 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 3.3 ns
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 1.2 mm
Supply Voltage-Max 5.5 V 3.6 V
Supply Voltage-Min 4.5 V 3 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount NO YES
Technology BIPOLAR CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Transmit Delay-Max 25 ns
Width 7.62 mm 4.4 mm
Base Number Matches 2 2
Output Low Current-Max 0.002 A
Receiver Number of Bits 4

Compare DS96F172MJ/883 with alternatives

Compare DS90LV032ATMTC with alternatives