DS92001TLD
vs
DS92001TLD/NOPB
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
LLP-8
|
LLP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Differential Output |
YES
|
YES
|
Driver Number of Bits |
1
|
1
|
Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
Interface IC Type |
LINE TRANSCEIVER
|
LINE DRIVER
|
Interface Standard |
EIA-644-A; TIA-644-A
|
EIA-644-A; TIA-644-A
|
JESD-30 Code |
S-PDSO-N8
|
S-PDSO-N8
|
JESD-609 Code |
e0
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC8,.11,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
235
|
260
|
Qualification Status |
Not Qualified
|
|
Receive Delay-Max |
|
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
20
|
40
|
Transmit Delay-Max |
2 ns
|
2 ns
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
4
|
1
|
|
|
|
Compare DS92001TLD with alternatives
Compare DS92001TLD/NOPB with alternatives