DS90LV031AW-QML
vs
HD26C31FP-EL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
HITACHI LTD
Package Description
CERAMIC, DFP-16
SOP,
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
4
High Level Input Current-Max
0.00001 A
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-644; TIA-644; IEEE P1596.3
EIA-422-A
JESD-30 Code
R-GDFP-F16
R-PDSO-G16
JESD-609 Code
e0
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Out Swing-Min
0.25 V
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
SOP
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Screening Level
MIL-PRF-38535 Class Q
Seated Height-Max
2.032 mm
2.2 mm
Supply Voltage-Max
3.6 V
5.5 V
Supply Voltage-Min
3 V
4.5 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Transmit Delay-Max
3.5 ns
11 ns
Width
6.35 mm
5.5 mm
Base Number Matches
2
2
Part Package Code
SOIC
Pin Count
16
Length
10.06 mm
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Compare HD26C31FP-EL with alternatives