DS90LV031AW-QML vs DS90LV032ATMTC feature comparison

DS90LV031AW-QML National Semiconductor Corporation

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DS90LV032ATMTC National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description CERAMIC, DFP-16 0.100 INCH, PLASTIC, TSSOP-16
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES
Driver Number of Bits 4
High Level Input Current-Max 0.00001 A
Input Characteristics STANDARD DIFFERENTIAL
Interface IC Type LINE DRIVER LINE RECEIVER
Interface Standard EIA-644; TIA-644; IEEE P1596.3 EIA-644; TIA-644
JESD-30 Code R-GDFP-F16 R-PDSO-G16
JESD-609 Code e0 e0
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Out Swing-Min 0.25 V
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP TSSOP
Package Equivalence Code FL16,.3 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 3.3 ns
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 2.032 mm 1.2 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15)
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Transmit Delay-Max 3.5 ns
Width 6.35 mm 4.4 mm
Base Number Matches 1 4
Length 5 mm
Output Low Current-Max 0.002 A
Receiver Number of Bits 4

Compare DS90LV031AW-QML with alternatives

Compare DS90LV032ATMTC with alternatives