DS90CR286MTDX
vs
DS90CF386SLC/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Package Description
LOW PROFILE, PLASTIC, TSSOP-56
0.80 MM PITCH, FBGA-64
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Differential Output
NO
Input Characteristics
DIFFERENTIAL
DIFFERENTIAL
Interface IC Type
LINE RECEIVER
LINE RECEIVER
Interface Standard
GENERAL PURPOSE
EIA-644; TIA-644
JESD-30 Code
R-PDSO-G56
S-PBGA-B64
JESD-609 Code
e0
e1
Length
14 mm
8 mm
Moisture Sensitivity Level
2
4
Number of Functions
4
4
Number of Terminals
56
64
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
-10 °C
Output Characteristics
TOTEM-POLE
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
LFBGA
Package Equivalence Code
TSSOP56,.3,20
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
235
260
Qualification Status
Not Qualified
Receive Delay-Max
Receiver Number of Bits
4
4
Seated Height-Max
1.2 mm
1.5 mm
Supply Current-Max
105 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
6.1 mm
8 mm
Base Number Matches
2
1
Pbfree Code
Part Package Code
BGA
Pin Count
64
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