DS90CF383MTDX/NOPB vs BU8254KVT feature comparison

DS90CF383MTDX/NOPB Texas Instruments

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BU8254KVT ROHM Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Active
parentfamilyid 4214790
Ihs Manufacturer TEXAS INSTRUMENTS INC ROHM CO LTD
Part Package Code TSSOP QFP
Package Description LOW PROFILE, PLASTIC, TSSOP-56 QFP, TQFP64,.47SQ
Pin Count 56 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 1997-06-01
kg CO2e/kg 11.7
Average Weight (mg) 264.95
CO2e (mg) 3099.915
Samacsys Description LVDS Interface IC 3.3V, 24-Bit FPD Link LVDS Transmitter
Samacsys Manufacturer Texas Instruments
Samacsys Modified On 2023-03-07 16:10:32
Total Weight 251.684931
Category CO2 Kg 11.7
CO2 2944.7136926999997
Compliance Temperature Grade Industrial: -40C to +85C
EU RoHS Version RoHS 2 (2015/863/EU)
Candidate List Date 2024-06-27
CAS Accounted for Wt 98
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 7440-02-0
EFUP e
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V6.31
Differential Output YES
Driver Number of Bits 5
Input Characteristics STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-644; TIA-644
JESD-30 Code R-PDSO-G56 S-PQFP-G64
JESD-609 Code e3 e2
Length 14 mm
Moisture Sensitivity Level 2
Number of Functions 1
Number of Terminals 56 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -20 °C
Out Swing-Min 2.7 V
Output Characteristics DIFFERENTIAL
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP QFP
Package Equivalence Code TSSOP56,.3,20 TQFP64,.47SQ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH FLATPACK
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Current-Max 55 mA
Supply Voltage-Nom 3.3 V 3.3 V
Supply Voltage1-Max 3.6 V
Supply Voltage1-Min 3 V
Supply Voltage1-Nom 3.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Matte Tin (Sn) Tin/Copper (Sn/Cu)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 10
Width 6.1 mm
Base Number Matches 1 2

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