DS90C385MDC
vs
V385GLF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
DIE, DIE OR CHIP
ROHS COMPLIANT, TSSOP-56
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
5
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-644; TIA-644
EIA-644; TIA-644
JESD-30 Code
X-XUUC-N
R-PDSO-G56
Number of Functions
4
5
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-10 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
TSSOP
Package Equivalence Code
DIE OR CHIP
TSSOP56,.3,20
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
60 mA
0.01 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
TSSOP
Pin Count
56
JESD-609 Code
e3
Length
14 mm
Moisture Sensitivity Level
1
Number of Terminals
56
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.2 mm
Terminal Finish
Matte Tin (Sn) - annealed
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
6.1 mm
Compare DS90C385MDC with alternatives
Compare V385GLF with alternatives