DS3134
vs
DS26556N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, PLASTIC, BGA-256
17 X 17 MM, 1 MM PITCH, BGA-256
Pin Count
256
256
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Length
27 mm
17 mm
Number of Functions
1
1
Number of Terminals
256
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.34 mm
1.76 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Telecom IC Type
FRAMER
FRAMER
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
17 mm
Base Number Matches
3
1
Pbfree Code
ECCN Code
EAR99
Carrier Type
CEPT PCM-30/E-1
Carrier Type (2)
T-1(DS1)
Moisture Sensitivity Level
3
Package Equivalence Code
BGA256,16X16,40
Supply Current-Max
875 mA
Compare DS3134 with alternatives
Compare DS26556N with alternatives