DS26LS31MJFQML
vs
DS26F31MJ-QMLV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
4
High Level Input Current-Max
0.00002 A
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-422; FED STD 1020
EIA-422; FED STD 1020
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Length
19.43 mm
19.94 mm
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Out Swing-Min
2 V
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Screening Level
MIL-PRF-38535 Class Q
MIL-PRF-38535 Class V
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn63Pb37)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Total Dose
300k Rad(Si) V
Transmit Delay-Max
20 ns
25 ns
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
16
Additional Feature
LG_MAX; SEATED HGT-NOM
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Compare DS26F31MJ-QMLV with alternatives