DS26LS31MJFQML vs 5962-7802301MEX feature comparison

DS26LS31MJFQML Texas Instruments

Buy Now Datasheet

5962-7802301MEX NXP Semiconductors

Buy Now
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature LG_MAX; SEATED HGT-NOM
Differential Output YES YES
Driver Number of Bits 4 4
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422; FED STD 1020
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Length 19.94 mm 19.43 mm
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 300k Rad(Si) V
Transmit Delay-Max 30 ns 30 ns
Width 7.62 mm 7.62 mm
Base Number Matches 2 10
Technology BIPOLAR

Compare DS26LS31MJFQML with alternatives

Compare 5962-7802301MEX with alternatives