DS26F31MJ-QMLV
vs
AM26LS31IN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
4
High Level Input Current-Max
0.00002 A
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-422; FED STD 1020
EIA-422; FED STD 1020
JESD-30 Code
R-CDIP-T16
R-PDIP-T16
JESD-609 Code
e0
Length
19.43 mm
19.025 mm
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Out Swing-Min
2 V
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Screening Level
MIL-PRF-38535 Class V
Seated Height-Max
5.08 mm
4.2 mm
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Total Dose
300k Rad(Si) V
Transmit Delay-Max
25 ns
20 ns
Width
7.62 mm
7.62 mm
Base Number Matches
2
3
Part Package Code
DIP
Pin Count
16
Output Polarity
COMPLEMENTARY
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