DS26C31MMW8
vs
DS26C31TMWC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
WAFER
Package Description
DIE, WAFER
DIE,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
4
High Level Input Current-Max
0.000001 A
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-422
EIA-422
JESD-30 Code
X-XUUC-N
X-XUUC-N16
Number of Functions
4
4
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Out Swing-Min
2 V
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Equivalence Code
WAFER
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Qualification Status
Not Qualified
Receive Delay-Max
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Transmit Delay-Max
14 ns
11 ns
Base Number Matches
3
3
Number of Terminals
16
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare DS26C31MMW8 with alternatives
Compare DS26C31TMWC with alternatives