DS14C88N
vs
MC14C88BD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP-14
SOP, SOP14,.25
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Additional Feature
1 SINGLE INPUT DRIVER
Differential Output
NO
NO
Driver Number of Bits
4
4
High Level Input Current-Max
0.00001 A
0.00001 A
Input Characteristics
GATED
Interface IC Type
LINE DRIVER
Interface Standard
EIA-232-D; V.28
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e0
Length
19.18 mm
Moisture Sensitivity Level
1
Number of Functions
4
Number of Terminals
14
14
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-40 °C
Out Swing-Min
6 V
7.4 V
Output Characteristics
TOTEM-POLE
Output Polarity
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Seated Height-Max
5.08 mm
Supply Voltage-Max
12 V
Supply Voltage-Min
5 V
Surface Mount
NO
YES
Technology
CMOS
BICMOS
Temperature Grade
COMMERCIAL EXTENDED
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Transmit Delay-Max
6000 ns
3500 ns
Width
7.62 mm
Base Number Matches
2
4
Power Supplies
+-4.5/+-15 V
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