DS0056CN
vs
DS0026MDC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
DIE, DIE OR CHIP
Pin Count
8
Reach Compliance Code
unknown
unknown
Family
DS00
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDIP-T8
X-XUUC-N
Length
9.817 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Number of Functions
2
2
Number of Inverted Outputs
1
1
Number of Terminals
8
Number of True Outputs
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIE
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
IN-LINE
UNCASED CHIP
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
20 V
10 V
Supply Voltage-Min (Vsup)
10 V
5 V
Surface Mount
NO
YES
Technology
MOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Width
7.62 mm
Base Number Matches
4
2
HTS Code
8542.39.00.01
Max I(ol)
0.001 A
Package Equivalence Code
DIE OR CHIP
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