DS0056CN vs DS0026MDC feature comparison

DS0056CN Rochester Electronics LLC

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DS0026MDC National Semiconductor Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIE, DIE OR CHIP
Pin Count 8
Reach Compliance Code unknown unknown
Family DS00
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T8 X-XUUC-N
Length 9.817 mm
Logic IC Type LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER
Number of Functions 2 2
Number of Inverted Outputs 1 1
Number of Terminals 8
Number of True Outputs
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 20 V 10 V
Supply Voltage-Min (Vsup) 10 V 5 V
Surface Mount NO YES
Technology MOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 7.62 mm
Base Number Matches 4 2
HTS Code 8542.39.00.01
Max I(ol) 0.001 A
Package Equivalence Code DIE OR CHIP

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