DPZ4MX16NV3-12I
vs
DPZ8MX16NV3-12M
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
TWILIGHT TECHNOLOGY INC
Part Package Code
PGA
Package Description
1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
PGA, PGA66,11X11
Pin Count
66
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
120 ns
120 ns
Additional Feature
AUTOMATIC WRITE
Alternate Memory Width
8
JESD-30 Code
S-CPGA-P66
S-XPGA-P66
Memory Density
67108864 bit
134217728 bit
Memory IC Type
FLASH MODULE
FLASH MODULE
Memory Width
16
16
Number of Functions
1
Number of Terminals
66
66
Number of Words
4194304 words
8388608 words
Number of Words Code
4000000
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
4MX16
8MX16
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12 V
Qualification Status
Not Qualified
Seated Height-Max
10.16 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
2
Rohs Code
Command User Interface
YES
Data Polling
NO
Number of Sectors/Size
128
Package Equivalence Code
PGA66,11X11
Sector Size
64K
Standby Current-Max
0.0024 A
Supply Current-Max
0.13 mA
Toggle Bit
NO
Write Protection
HARDWARE
Compare DPZ4MX16NV3-12I with alternatives