DPZ4MX16NV3-12I
vs
WF2M32-120HM5
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
WHITE MICROELECTRONICS
Part Package Code
PGA
Package Description
1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
1.185 INCH, CERAMIC, HIP-66
Pin Count
66
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
120 ns
120 ns
Additional Feature
AUTOMATIC WRITE
ALSO CONFIGURABLE AS 8M X 8
Alternate Memory Width
8
16
JESD-30 Code
S-CPGA-P66
S-CHIP-P66
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH MODULE
FLASH MODULE
Memory Width
16
32
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
4194304 words
2097152 words
Number of Words Code
4000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
4MX16
2MX32
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
10.16 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
HEX
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
4
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