DPS8M656-45M
vs
DPS8M656-70M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
DPAC TECHNOLOGIES CORP
Package Description
DIP, DIP40,.6
DIP, DIP40,.6
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDMA-T40
R-XDMA-T40
JESD-609 Code
e0
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
40
40
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
16KX16
16KX16
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0012 A
0.0012 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.64 mA
0.64 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Compare DPS8M656-45M with alternatives
Compare DPS8M656-70M with alternatives