DPS256X32BV3-35C vs WS256K32L-35HMA feature comparison

DPS256X32BV3-35C Twilight Technology Inc

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WS256K32L-35HMA White Microelectronics

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TWILIGHT TECHNOLOGY INC WHITE MICROELECTRONICS
Part Package Code PGA
Package Description PGA, PGA66,11X11 CERAMIC, HIP-66
Pin Count 66
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
Alternate Memory Width 16 16
I/O Type COMMON
JESD-30 Code S-CPGA-P66 S-CHIP-P66
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 256KX32 256KX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA66,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 10.16 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.5 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR HEX
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
Screening Level MIL-STD-883

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Compare WS256K32L-35HMA with alternatives