WS256K32L-35HMA
vs
DPS256X32BV3-25B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
WHITE MICROELECTRONICS
TWILIGHT TECHNOLOGY INC
Package Description
CERAMIC, HIP-66
PGA, PGA66,11X11
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Category CO2 Kg
12
12
Compliance Temperature Grade
Military: -55C to +125C
Military: -55C to +125C
Access Time-Max
35 ns
25 ns
Alternate Memory Width
16
16
JESD-30 Code
S-CHIP-P66
S-CPGA-P66
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
256KX32
256KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
IN-LINE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883 Class B (Modified)
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
HEX
PERPENDICULAR
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
PGA
Pin Count
66
I/O Type
COMMON
Output Characteristics
3-STATE
Package Code
PGA
Package Equivalence Code
PGA66,11X11
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
10.16 mm
Standby Current-Max
0.0144 A
Standby Voltage-Min
2 V
Supply Current-Max
0.68 mA
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare WS256K32L-35HMA with alternatives
Compare DPS256X32BV3-25B with alternatives