WS256K32L-35HMA
vs
DPS256X32CV3-30I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WHITE MICROELECTRONICS
DPAC TECHNOLOGIES CORP
Package Description
CERAMIC, HIP-66
PGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
30 ns
Alternate Memory Width
16
16
JESD-30 Code
S-CHIP-P66
S-CPGA-P66
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
256KX32
256KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
IN-LINE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
HEX
PERPENDICULAR
Base Number Matches
2
2
Part Package Code
PGA
Pin Count
66
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
YES
Package Code
PGA
Seated Height-Max
10.16 mm
Standby Voltage-Min
2 V
Terminal Pitch
2.54 mm
Compare WS256K32L-35HMA with alternatives
Compare DPS256X32CV3-30I with alternatives