DP8428V-70X
vs
DP8409AV-3
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
QCCJ,
|
QCCJ, LDCC68,1.0SQ
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
20
|
18
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
70 MHz
|
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
Length |
24.2316 mm
|
24.2316 mm
|
Low Power Mode |
NO
|
NO
|
Memory Organization |
1M X 1
|
256K X 1
|
Number of Banks |
2
|
4
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Supply Current-Max |
240 mA
|
325 mA
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
MOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.2316 mm
|
24.2316 mm
|
uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
LDCC68,1.0SQ
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare DP8428V-70X with alternatives
Compare DP8409AV-3 with alternatives