DP8409AV-3 vs 673104ANLTR feature comparison

DP8409AV-3 Texas Instruments

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673104ANLTR AMD

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Package Description QCCJ, LDCC68,1.0SQ QCCJ,
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 18 20
Boundary Scan NO NO
External Data Bus Width
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e0
Length 24.2316 mm 24.2062 mm
Low Power Mode NO NO
Memory Organization 256K X 1 1M X 1
Number of Banks 4 4
Number of Terminals 68 68
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.57 mm
Supply Current-Max 325 mA 280 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 24.2316 mm 24.2062 mm
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM
Base Number Matches 2 1
Part Package Code LCC
Pin Count 68

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