DP8409AV-3
vs
HD63485CP32
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
HITACHI LTD
Package Description
QCCJ, LDCC68,1.0SQ
QCCJ, LDCC68,1.0SQ
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
18
19
Boundary Scan
NO
NO
External Data Bus Width
JESD-30 Code
S-PQCC-J68
S-PQCC-J68
JESD-609 Code
e0
e0
Length
24.2316 mm
24.2 mm
Low Power Mode
NO
NO
Memory Organization
256K X 1
Number of Banks
4
1
Number of Terminals
68
68
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC68,1.0SQ
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.6 mm
Supply Current-Max
325 mA
160 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
MOS
BICMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
24.2316 mm
24.2 mm
uPs/uCs/Peripheral ICs Type
MEMORY CONTROLLER, DRAM
MEMORY CONTROLLER, DRAM
Base Number Matches
2
1
Part Package Code
LCC
Pin Count
68
Compare DP8409AV-3 with alternatives
Compare HD63485CP32 with alternatives