DAC1408D750HN/C1,5
vs
DAC1208D750HN-C1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
|
| JESD-30 Code |
S-PQCC-N64
|
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Bits |
14
|
12
|
| Number of Functions |
2
|
|
| Number of Terminals |
64
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QCCN
|
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
VFQFPN
|
| Pin Count |
|
64
|
| Manufacturer Package Code |
|
NLG64
|
| HTS Code |
|
8542.39.00.01
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare DAC1408D750HN/C1,5 with alternatives
Compare DAC1208D750HN-C1 with alternatives