CYP15G0402DXB-BGC
vs
CYP15G0402DXB-BGXC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 1.57 MM HEIGHT, TBGA-256
27 X 27 MM, 1.57 MM HEIGHT, LEAD FREE, TBGA-256
Pin Count
256
256
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
256
256
Number of Transceivers
4
4
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,20X20,50
BGA256,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.745 mm
1.745 mm
Supply Current-Max
1.1 mA
1.1 mA
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
1
1
Data Rate
1500000 Mbps
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
20
Compare CYP15G0402DXB-BGC with alternatives
Compare CYP15G0402DXB-BGXC with alternatives