CYP15G0402DXB-BGXC
vs
CYP15G0402DX-BGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 1.57 MM HEIGHT, LEAD FREE, TBGA-256
27 X 27 MM, 1.52 MM HEIGHT, THERMALLY ENHANCED, BGA-256
Pin Count
256
256
Reach Compliance Code
unknown
compliant
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
NOT SPECIFIED
3
Number of Functions
1
1
Number of Terminals
256
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.745 mm
1.745 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
27 mm
27 mm
Base Number Matches
2
1
HTS Code
8542.39.00.01
Package Equivalence Code
BGA256,20X20,50
Compare CYP15G0402DXB-BGXC with alternatives
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