CYP15G0402DXB-BGC vs CYP15G0402DX-BGI feature comparison

CYP15G0402DXB-BGC Cypress Semiconductor

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CYP15G0402DX-BGI Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1.57 MM HEIGHT, TBGA-256 27 X 27 MM, 1.52 MM HEIGHT, THERMALLY ENHANCED, BGA-256
Pin Count 256 256
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 256 256
Number of Transceivers 4
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,20X20,50 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.745 mm 1.745 mm
Supply Current-Max 1.1 mA
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 2 1
Pbfree Code No

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