CY7C63823-XC
vs
CY7C63823-SXCT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIE
SOIC
Package Description
DIE-23
SOIC-24
Pin Count
23
24
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.3
3A991.A.3
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
ALSO OPERATES BETWEEN 4.35-5.25 V IN USB ACTIVITY
ALSO OPERATES BETWEEN 4.35-5.25 V IN USB ACTIVITY
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
24 MHz
24 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
X-XUUC-N23
R-PDSO-G24
Number of I/O Lines
20
20
Number of Terminals
23
24
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
PWM Channels
NO
NO
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Speed
24 MHz
24 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4 V
4 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
2
CPU Family
M8C
JESD-609 Code
e4
Length
15.392 mm
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Package Equivalence Code
SOP24,.4
RAM (bytes)
256
ROM (words)
8192
Seated Height-Max
2.667 mm
Supply Current-Max
40 mA
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch
1.27 mm
Width
7.5055 mm
Compare CY7C63823-XC with alternatives
Compare CY7C63823-SXCT with alternatives