CY7C63823-XC
vs
CY7C63101C-QXC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIE
SOIC
Package Description
DIE-23
0.150 INCH, LEAD FREE, QSOP-24
Pin Count
23
24
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.3
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
ALSO OPERATES BETWEEN 4.35-5.25 V IN USB ACTIVITY
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
24 MHz
6 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
X-XUUC-N23
R-PDSO-G24
Number of I/O Lines
20
16
Number of Terminals
23
24
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
PWM Channels
NO
NO
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SSOP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
OTPROM
Speed
24 MHz
12 MHz
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER, RISC
Base Number Matches
2
2
JESD-609 Code
e4
Length
8.6487 mm
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Package Equivalence Code
SSOP24,.24
RAM (bytes)
128
ROM (words)
4096
Seated Height-Max
1.7526 mm
Supply Current-Max
25 mA
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch
0.635 mm
Width
3.8989 mm
Compare CY7C63823-XC with alternatives
Compare CY7C63101C-QXC with alternatives