CY7C516-45GC
vs
IDT7216L25P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PGA
DIP
Package Description
CAVITY-DOWN, CERAMIC, PGA-68
0.900 INCH, PLASTIC, DIP-64
Pin Count
68
64
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Boundary Scan
NO
NO
Clock Frequency-Max
22.22 MHz
40 MHz
External Data Bus Width
16
16
JESD-30 Code
S-CPGA-P68
R-PDIP-T64
JESD-609 Code
e0
e0
Length
27.94 mm
81.534 mm
Low Power Mode
NO
YES
Number of Terminals
68
64
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Data Bus Width
32
32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
PGA
DIP
Package Equivalence Code
PGA68,11X11
DIP64,.9
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
100 mA
200 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
DUAL
Width
27.94 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER
DSP PERIPHERAL, MULTIPLIER
Base Number Matches
1
1
ECCN Code
3A991.A.2
Seated Height-Max
5.842 mm
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