CY7C150-15DMB
vs
SY101L474-5DCS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SYNERGY SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
0.300 INCH, CERDIP-24
Pin Count
24
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
15 ns
5 ns
Additional Feature
MEMORY RESET FUNCTION
TEMP SPECIFIED AS TC
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
31.877 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
24
24
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
Organization
1KX4
1KX4
Output Characteristics
3-STATE
OPEN-EMITTER
Output Enable
YES
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Standby Current-Max
0.1 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.1 mA
0.18 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
ECL
Temperature Grade
MILITARY
OTHER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
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