CY7C1382FV25-200BGC vs CXK77N36R160GB-33 feature comparison

CY7C1382FV25-200BGC Cypress Semiconductor

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CXK77N36R160GB-33 Sony Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SONY CORP
Part Package Code BGA BGA
Package Description 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 BGA, BGA119,7X17,50
Pin Count 119 119
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 1.7 ns
Additional Feature PIPELINED ARCHITECTURE IT CAN ALSO OPERATE WITH 2.5V NOMINAL SUPPLY
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type CACHE SRAM LATE-WRITE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 1048576 words 524288 words
Number of Words Code 1000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 1MX18 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Supply Voltage-Max (Vsup) 2.625 V 2.63 V
Supply Voltage-Min (Vsup) 2.375 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Clock Frequency-Max (fCLK) 303 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Standby Current-Max 0.16 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.5 mA

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