CY7C1382FV25-200BGC
vs
K7N401801A-TC160
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
14 X 22 MM, 2.40 MM HEIGHT, BGA-119
|
LQFP,
|
| Pin Count |
119
|
100
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
3 ns
|
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
|
| JESD-30 Code |
R-PBGA-B119
|
|
| JESD-609 Code |
e0
|
|
| Length |
22 mm
|
|
| Memory Density |
18874368 bit
|
|
| Memory IC Type |
CACHE SRAM
|
|
| Memory Width |
18
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
119
|
|
| Number of Words |
1048576 words
|
|
| Number of Words Code |
1000000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
1MX18
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.4 mm
|
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
14 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CY7C1382FV25-200BGC with alternatives
Compare K7N401801A-TC160 with alternatives