CXK77N36R160GB-33 vs HM66AEB36102BP-30 feature comparison

CXK77N36R160GB-33 Sony Semiconductor

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HM66AEB36102BP-30 Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SONY CORP RENESAS TECHNOLOGY CORP
Part Package Code BGA BGA
Package Description BGA, BGA119,7X17,50 LBGA, BGA165,11X15,40
Pin Count 119 165
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 1.7 ns 0.45 ns
Additional Feature IT CAN ALSO OPERATE WITH 2.5V NOMINAL SUPPLY
Clock Frequency-Max (fCLK) 303 MHz 333 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B165
JESD-609 Code e0
Length 22 mm 17 mm
Memory Density 18874368 bit 37748736 bit
Memory IC Type LATE-WRITE SRAM DDR SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 165
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Organization 512KX36 1MX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA119,7X17,50 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.46 mm
Standby Current-Max 0.16 A 0.35 A
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.5 mA 0.88 mA
Supply Voltage-Max (Vsup) 2.63 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 15 mm
Base Number Matches 1 1
Moisture Sensitivity Level 1

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