CY7C1324H-100AXC vs IBM0436A41QLAB-3P feature comparison

CY7C1324H-100AXC Cypress Semiconductor

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IBM0436A41QLAB-3P IBM

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP IBM MICROELECTRONICS
Part Package Code QFP BGA
Package Description LQFP, BGA, BGA119,7X17,50
Pin Count 100 119
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8 ns 1.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PQFP-G100 R-PBGA-B119
JESD-609 Code e4 e0
Length 20 mm 22 mm
Memory Density 2359296 bit 4718592 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 18 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 128KX18 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.679 mm
Supply Voltage-Max (Vsup) 3.6 V 3.63 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Standby Current-Max 0.1 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.47 mA

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