CY7C1324H-100AXC
vs
K7A163600M-TC16
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LQFP,
|
LQFP,
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
8 ns
|
|
| Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
|
| JESD-30 Code |
R-PQFP-G100
|
|
| JESD-609 Code |
e4
|
|
| Length |
20 mm
|
|
| Memory Density |
2359296 bit
|
|
| Memory IC Type |
CACHE SRAM
|
|
| Memory Width |
18
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
100
|
|
| Number of Words |
131072 words
|
|
| Number of Words Code |
128000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
128KX18
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LQFP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK, LOW PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CY7C1324H-100AXC with alternatives
Compare K7A163600M-TC16 with alternatives