IBM0436A41QLAB-3P vs IDT71V2556XS133BQI feature comparison

IBM0436A41QLAB-3P IBM

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IDT71V2556XS133BQI Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IBM MICROELECTRONICS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA119,7X17,50 TBGA,
Pin Count 119 165
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 1.5 ns 4.2 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B165
JESD-609 Code e0 e0
Length 22 mm 15 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type STANDARD SRAM ZBT SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 165
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Organization 128KX36 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TBGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.679 mm 1.2 mm
Standby Current-Max 0.1 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.47 mA
Supply Voltage-Max (Vsup) 3.63 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 13 mm
Base Number Matches 1 1
Additional Feature PIPELINED ARCHITECTURE
Moisture Sensitivity Level 3

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