CY7C1306BV25-167BZI
vs
MCM69F817ZP6.5R
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
(13 X 15 X 1.4) MM, LEAD FREE, PLASTIC, FBGA-165
BGA,
Pin Count
165
119
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.1 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
167 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e0
Length
15 mm
Memory Density
18874368 bit
Memory IC Type
QDR SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
165
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
Standby Current-Max
0.24 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.5 mA
Supply Voltage-Max (Vsup)
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
13 mm
Base Number Matches
1
1
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