CY7C1143KV18-400BZC
vs
K7B401825A-TC65
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
QFP
Package Description
13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
LQFP,
Pin Count
165
100
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
6.5 ns
Additional Feature
PIPELINED ARCHITECTURE
SELF-TIMED WRITE CYCLE
Clock Frequency-Max (fCLK)
400 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
Length
15 mm
20 mm
Memory Density
18874368 bit
4718592 bit
Memory IC Type
QDR SRAM
CACHE SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
1048576 words
262144 words
Number of Words Code
1000000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX18
256KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LQFP
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.6 mm
Standby Current-Max
0.29 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.61 mA
Supply Voltage-Max (Vsup)
1.9 V
3.6 V
Supply Voltage-Min (Vsup)
1.7 V
3.135 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
13 mm
14 mm
Base Number Matches
1
1
Compare CY7C1143KV18-400BZC with alternatives
Compare K7B401825A-TC65 with alternatives