CY7B994V-5BBIT
vs
MC100EP220TB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
BGA
Package Description
11 X 11 MM, 1.40 MM HEIGHT, BGA-100
HLQFP,
Pin Count
100
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CONFIGURABLE AS SINGLE ENDED TTL ALSO
ECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V
Family
7B
100E
Input Conditioning
DIFFERENTIAL MUX
DIFFERENTIAL
JESD-30 Code
S-PBGA-B100
S-PQFP-G52
JESD-609 Code
e0
e0
Length
11 mm
10 mm
Logic IC Type
PLL BASED CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Max I(ol)
0.002 A
Moisture Sensitivity Level
3
Number of Functions
1
2
Number of Inverted Outputs
Number of Terminals
100
52
Number of True Outputs
16
10
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
HLQFP
Package Equivalence Code
BGA100,10X10,40
QFP52,.47SQ
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
0.5 ns
Propagation Delay (tpd)
0.5 ns
0.55 ns
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.65 ns
0.06 ns
Seated Height-Max
1.4 mm
1.7 mm
Supply Voltage-Max (Vsup)
3.63 V
3.8 V
Supply Voltage-Min (Vsup)
2.97 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11 mm
10 mm
fmax-Min
200 MHz
Base Number Matches
1
2
Technology
ECL
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Compare MC100EP220TB with alternatives