CY5057K-11WAF-IL
vs
843N571AKILF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
RENESAS ELECTRONICS CORP
Part Package Code
WAFER
Package Description
DIE,
6 X 6 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO-220VJJD-2/5, VFQFN-40
Pin Count
10
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
JESD-30 Code
R-XUUC-N10
S-XQCC-N40
Number of Terminals
10
40
Output Clock Frequency-Max
170 MHz
156.25 MHz
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
UNCASED CHIP
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Primary Clock/Crystal Frequency-Nom
25.1 MHz
25 MHz
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
QUAD
uPs/uCs/Peripheral ICs Type
CLOCK GENERATOR, OTHER
CLOCK GENERATOR, OTHER
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e3
Length
6 mm
Moisture Sensitivity Level
3
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
LCC40,.24SQ,20
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1 mm
Supply Current-Max
250 mA
Temperature Grade
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
6 mm
Compare CY5057K-11WAF-IL with alternatives
Compare 843N571AKILF with alternatives