CY39200Z676-125MBC vs CY39200Z676-125MBI feature comparison

CY39200Z676-125MBC Cypress Semiconductor

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CY39200Z676-125MBI Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1.6 MM HEIGHT, 1 MM PITCH, FBGA-676 27 X 27 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-676
Pin Count 676 676
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
In-System Programmable YES YES
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e0
JTAG BST YES YES
Length 27 mm 27 mm
Number of Dedicated Inputs
Number of I/O Lines 428 386
Number of Macro Cells 3072 3072
Number of Terminals 676 676
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 428 I/O 0 DEDICATED INPUTS, 386 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max 1.95 V 1.95 V
Supply Voltage-Min 1.65 V 1.65 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 1

Compare CY39200Z676-125MBC with alternatives

Compare CY39200Z676-125MBI with alternatives