CY39200Z484-83BBI
vs
CY39200Z208-83NC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
QFP
Package Description
23 X 23 MM, 1.6 MM HEIGHT, 1 MM PITCH, FBGA-484
PLASTIC, QFP-208
Pin Count
484
208
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B484
S-PQFP-G208
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
23 mm
28 mm
Number of Dedicated Inputs
Number of I/O Lines
368
136
Number of Macro Cells
3072
3072
Number of Terminals
484
208
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 368 I/O
0 DEDICATED INPUTS, 136 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
FQFP
Package Equivalence Code
BGA484,22X22,40
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, FINE PITCH
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
15 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
3.77 mm
Supply Voltage-Max
1.95 V
1.95 V
Supply Voltage-Min
1.65 V
1.65 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
23 mm
28 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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