CY39200V388-125MGI
vs
CY39200Z484-83BBI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA-388
23 X 23 MM, 1.6 MM HEIGHT, 1 MM PITCH, FBGA-484
Pin Count
388
484
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
IT CAN ALSO HAVE AN INPUT VOLTAGE OF 3.3V
YES
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B484
JTAG BST
YES
YES
Length
35 mm
23 mm
Number of Dedicated Inputs
Number of I/O Lines
294
368
Number of Macro Cells
3072
3072
Number of Terminals
388
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
0 DEDICATED INPUTS, 294 I/O
0 DEDICATED INPUTS, 368 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA388,26X26,50
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
10 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.46 mm
1.6 mm
Supply Voltage-Max
2.7 V
1.95 V
Supply Voltage-Min
2.3 V
1.65 V
Supply Voltage-Nom
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
35 mm
23 mm
Base Number Matches
1
1
JESD-609 Code
e0
Terminal Finish
TIN LEAD
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