CY15B016Q-SXA
vs
47L16-I/ST
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Package Description
SOIC-8
TSSOP-8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.51
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
4.889 mm
4.4 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
8
8
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2KX8
2KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Seated Height-Max
1.727 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
PURE TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
3.8985 mm
3 mm
Base Number Matches
2
1
Factory Lead Time
7 Weeks
Date Of Intro
2016-10-10
Samacsys Manufacturer
Microchip
Access Time-Max
400 ns
JESD-609 Code
e3
Mixed Memory Type
EEPROM+SRAM
Number of Ports
1
Package Equivalence Code
TSSOP8,.25
Time@Peak Reflow Temperature-Max (s)
40
Compare CY15B016Q-SXA with alternatives
Compare 47L16-I/ST with alternatives