CXK77Q18162GB-27 vs K7D161888M-HC330 feature comparison

CXK77Q18162GB-27 Sony Semiconductor

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K7D161888M-HC330 Samsung Semiconductor

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SONY CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA153,9X17,50 BGA,
Pin Count 153 153
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 1.9 ns
Clock Frequency-Max (fCLK) 370 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B153 R-PBGA-B153
JESD-609 Code e0
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 153 153
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Organization 1MX18 1MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA153,9X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.3 mm 2.21 mm
Standby Voltage-Min 2.38 V
Supply Current-Max 0.7 mA
Supply Voltage-Max (Vsup) 2.63 V 1.9 V
Supply Voltage-Min (Vsup) 2.37 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Additional Feature PIPELINED ARCHITECTURE

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