There are no models available for this part yet.
Overview of K7D161888M-HC330 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Automotive
CAD Models for K7D161888M-HC330 by Samsung Semiconductor
Part Data Attributes for K7D161888M-HC330 by Samsung Semiconductor
|
|
|
|---|---|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
BGA,
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|
Pin Count
|
153
|
|
Reach Compliance Code
|
unknown
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|
ECCN Code
|
3A991.B.2.A
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|
HTS Code
|
8542.32.00.41
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|
Additional Feature
|
PIPELINED ARCHITECTURE
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|
JESD-30 Code
|
R-PBGA-B153
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Length
|
22 mm
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|
Memory Density
|
18874368 bit
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Memory IC Type
|
DDR SRAM
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|
Memory Width
|
18
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Number of Functions
|
1
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Number of Terminals
|
153
|
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Number of Words
|
1048576 words
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|
Number of Words Code
|
1000000
|
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Operating Mode
|
SYNCHRONOUS
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|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
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|
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Organization
|
1MX18
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Package Body Material
|
PLASTIC/EPOXY
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Package Code
|
BGA
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Package Shape
|
RECTANGULAR
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Package Style
|
GRID ARRAY
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|
Parallel/Serial
|
PARALLEL
|
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Qualification Status
|
Not Qualified
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Seated Height-Max
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2.21 mm
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
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|
Supply Voltage-Min (Vsup)
|
1.7 V
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|
Supply Voltage-Nom (Vsup)
|
1.8 V
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Surface Mount
|
YES
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Technology
|
CMOS
|
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Temperature Grade
|
COMMERCIAL
|
|
Terminal Form
|
BALL
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Terminal Pitch
|
1.27 mm
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Terminal Position
|
BOTTOM
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|
Width
|
14 mm
|
Alternate Parts for K7D161888M-HC330
This table gives cross-reference parts and alternative options found for K7D161888M-HC330. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7D161888M-HC330, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IBM041816CXLBC-20 | DDR SRAM, 1MX18, 2.3ns, CMOS, PBGA153, BGA-153 | IBM | K7D161888M-HC330 vs IBM041816CXLBC-20 |
| IBM041816CBLBC-27 | DDR SRAM, 1MX18, 2ns, CMOS, PBGA153, BGA-153 | IBM | K7D161888M-HC330 vs IBM041816CBLBC-27 |
| CXK77Q18162GB-3 | DDR SRAM, 1MX18, 2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Sony Semiconductor | K7D161888M-HC330 vs CXK77Q18162GB-3 |
| K7D161888B-HC300 | DDR SRAM, 1MX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Samsung Semiconductor | K7D161888M-HC330 vs K7D161888B-HC300 |
| IBM041816CHLBC-25 | DDR SRAM, 1MX18, 1.8ns, CMOS, PBGA153, BGA-153 | IBM | K7D161888M-HC330 vs IBM041816CHLBC-25 |
| K7D161874B-HC270 | DDR SRAM, 1MX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Samsung Semiconductor | K7D161888M-HC330 vs K7D161874B-HC270 |
| CXK77Q18162AGB-25 | DDR SRAM, 1MX18, 2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Sony Semiconductor | K7D161888M-HC330 vs CXK77Q18162AGB-25 |
| IBM041816CXLBC-28 | DDR SRAM, 1MX18, 1.8ns, CMOS, PBGA153, BGA-153 | IBM | K7D161888M-HC330 vs IBM041816CXLBC-28 |
| CXK77Q18162AGB-3 | DDR SRAM, 1MX18, 2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Sony Semiconductor | K7D161888M-HC330 vs CXK77Q18162AGB-3 |
| CXK77L18162GB-3 | DDR SRAM, 1MX18, 1.9ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Sony Semiconductor | K7D161888M-HC330 vs CXK77L18162GB-3 |