K7D161888M-HC330
vs
IBM041816CXLBC-20
feature comparison
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
IBM MICROELECTRONICS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA,
|
Pin Count |
153
|
153
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
JESD-30 Code |
R-PBGA-B153
|
R-PBGA-B153
|
Length |
22 mm
|
22 mm
|
Memory Density |
18874368 bit
|
18874368 bit
|
Memory IC Type |
DDR SRAM
|
DDR SRAM
|
Memory Width |
18
|
18
|
Number of Functions |
1
|
1
|
Number of Terminals |
153
|
153
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
1MX18
|
1MX18
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.21 mm
|
2.679 mm
|
Supply Voltage-Max (Vsup) |
1.9 V
|
2.625 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
Access Time-Max |
|
2.3 ns
|
|
|
|
Compare K7D161888M-HC330 with alternatives
Compare IBM041816CXLBC-20 with alternatives