CND2B10TTD823J vs RACF648R82K5%R feature comparison

CND2B10TTD823J KOA Speer Electronics Inc

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RACF648R82K5%R SEI Stackpole Electronics Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer KOA SPEER ELECTRONICS INC STACKPOLE ELECTRONICS INC
Package Description , 2512 CHIP, ROHS COMPLIANT
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
Element Power Dissipation 0.063 W 0.063 W
First Element Resistance 82000 Ω 82000 Ω
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Network Type BUSSED BUSSED
Number of Elements 8 8
Number of Functions 1 1
Number of Terminals 10 10
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, PAPER, 7 INCH TAPE, EMBOSSED
Rated Temperature 70 °C 70 °C
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Size Code 2512 1225
Surface Mount YES YES
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 1 1
HTS Code 8533.21.00.20
Construction Chip
Manufacturer Series RAC
Package Height 0.6 mm
Package Length 6.4 mm
Package Width 3.1 mm
Rated Power Dissipation (P) 0.063 W
Resistance 82000 Ω
Series RAC648R(5%)
Technology METAL GLAZE/THICK FILM

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Compare RACF648R82K5%R with alternatives