CLC446A8B
vs
OPA623AP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
BURR-BROWN CORP
|
| Package Description |
DIP, DIP8,.3
|
DIP, DIP8,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
CURRENT-FEEDBACK
|
CURRENT-FEEDBACK
|
| Common-mode Reject Ratio-Nom |
50 dB
|
50 dB
|
| Frequency Compensation |
YES
|
YES
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Low-Bias |
NO
|
NO
|
| Low-Offset |
NO
|
NO
|
| Micropower |
NO
|
NO
|
| Neg Supply Voltage Limit-Max |
-6 V
|
-6 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Nom |
2600 V/us
|
2100 V/us
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Wideband |
YES
|
YES
|
| Base Number Matches |
1
|
1
|
| Average Bias Current-Max (IIB) |
|
50 µA
|
| Bias Current-Max (IIB) @25C |
|
20 µA
|
| Common-mode Reject Ratio-Min |
|
43 dB
|
| Input Offset Voltage-Max |
|
30000 µV
|
| Unity Gain BW-Nom |
|
290000
|
|
|
|
Compare CLC446A8B with alternatives
Compare OPA623AP with alternatives